Title :
Investigation of lead frame package interconnection for mm-wave balanced circuit
Author_Institution :
M/A-COM Inc., Lowell, MA, USA
Abstract :
Differential SiGe circuit has been gaining popularity for low-cost mm-wave circuit. Plastic lead frame packages are believed to suit for device packaging for such low-cost system. In this paper, the design factors in the lead frame package interconnection for differential circuit that influence electrical performance are qualitatively investigated by numerical modeling. The results show certain factors affect differential mode insertion loss and/or common mode isolation.
Keywords :
Ge-Si alloys; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; millimetre wave integrated circuits; plastic packaging; SiGe; common mode isolation; device packaging; differential SiGe circuit; differential mode insertion loss; electrical performance; lead frame package interconnection; mm-wave balanced circuit; numerical modeling; plastic lead frame packages; Bonding; Electronics packaging; Feeds; Germanium silicon alloys; Impedance matching; Integrated circuit interconnections; Microstrip; Plastic packaging; Semiconductor device packaging; Silicon germanium;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563726
