Title :
Development of molded liquid crystal polymer surface mount packages for millimeter wave applications
Author :
Aihara, Kunia ; Chen, Andy C. ; Pham, Anh-Vu ; Roman, John W.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
Abstract :
We present the development of molded liquid crystal polymer (LCP) surface mount packages for millimeter wave applications. We show that a coplanar waveguide transmission line on a molded liquid crystal polymer has a measured insertion loss of less than 0.16 dB/mm. The LCP quad flat no-lead (QFN) has demonstrated a return loss of less than -16dB and insertion loss of less than -1.2 dB at 25 GHz.
Keywords :
coplanar transmission lines; coplanar waveguides; liquid crystal polymers; plastic packaging; surface mount technology; 25 GHz; coplanar waveguide; insertion loss; millimeter wave applications; molded liquid crystal polymer; quad flat no-lead; return loss; surface mount packages; transmission line; Coplanar transmission lines; Coplanar waveguides; Insertion loss; Liquid crystal polymers; Liquid waveguides; Loss measurement; Millimeter wave measurements; Packaging; Surface waves; Transmission line measurements;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563728
