Drop test for Sn96.7-Ag3.7 polymer core solder ball in BGA package

Author

Shih, Tien-Tsorng ; Chen, Bing- Hua ; Lee, Win-Der ; Wang, Mu-Chun

Author_Institution

Dept. of Electron. Eng., Nat. Kaohsiung Univ. of Appl. Sci., Taipei, Taiwan

fYear

2011

fDate

19-21 Oct. 2011

Firstpage

184

Lastpage

187

Abstract

Using polymer core solder ball in ball-grid-array (BGA) package instead of solid solder ball in cost consideration is a feasible choice. Besides the consideration for inter-metallic compound (IMC) between solder ball and carrier substrate, the reliability test for drop test is necessary. Following the commercial specification test conditions, this candidate demonstrates an impressive performance. The uniformity for the test results is also better than that with the control group. The slope value and scale parameter of Weibull distribution adopted in this statistic calculation illustrated the polymer core solder ball in BGA package owned the wonderful bombardment endurance capability, incorporated with the ENEPIG processing recipe for substrate metal finish.

Keywords

Weibull distribution; ball grid arrays; integrated circuit reliability; polymers; silver alloys; solders; tin alloys; BGA package; ENEPIG processing recipe; Sn-Ag; Weibull distribution; ball-grid-array; bombardment endurance capability; carrier substrate; drop test; intermetallic compound; polymer core solder ball; reliability test; Adhesives; Lead; Polymers; Reliability; Resistance; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International

Conference_Location

Taipei

ISSN

2150-5934

Print_ISBN

978-1-4577-1387-3

Electronic_ISBN

2150-5934

Type

conf

DOI

10.1109/IMPACT.2011.6117247

Filename

6117247