DocumentCode :
2842905
Title :
Methodology for on-package decoupling capacitor selection with considerations of coupled core and IO power delivery network and simultaneous switching noise effects
Author :
Mandhana, Om P.
Author_Institution :
Networking & Comput. Syst. Group, Freescale Semicond., Austin, TX, USA
fYear :
2005
fDate :
24-26 Oct. 2005
Firstpage :
175
Lastpage :
178
Abstract :
This paper presents an efficient methodology for on-package decoupling capacitors (DECAPS) selection with the considerations of minimizing the coupled core power delivery network (Core-PDN) and IO-power delivery network (IO-PDN) noise and the simultaneous switching noise (SSN). The effectiveness of on-die capacitance of the core-logic circuits on the estimation of the package DECAPS is described using the multiport broadband package model. The on-package DECAPS selection based on the current signature spectrum of core-PDN and IO-PDN is also discussed. Simulation results are presented for comparison of the effects of on-package DECAPS estimated with or without core die capacitance and by using power-ground current signature spectrum obtained through SSN simulation of the package.
Keywords :
capacitors; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; logic circuits; IO power delivery network; core power delivery network; core-logic circuits; current signature spectrum; multiport broadband package model; on-die capacitance; on-package decoupling capacitor; simultaneous switching noise effects; Capacitance; Frequency domain analysis; Impedance; Integrated circuit noise; Packaging; Power generation; Power semiconductor switches; Semiconductor device noise; Switched capacitor networks; Working environment noise;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
Type :
conf
DOI :
10.1109/EPEP.2005.1563730
Filename :
1563730
Link To Document :
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