Title :
Solder stability for Pb-free HBGA assembly with oxygenous reflow
Author :
Shih, Tien-Tsorng ; Chen, Wei-Chih ; Lee, Win-Der ; Wang, Mu-Chun
Author_Institution :
Dept. of Electron. Eng., Nat. Kaohsiung Univ. of Appl. Sci., Kaohsiung, Taiwan
Abstract :
In ball-grid-array (BGA) package technology, the oxygen concentration in flow process predominantly influences the quality of solder conjunction such as oxidation causing aged effect and quality of inter-metallic compound. In addition, the flux as solder assistance is also a key factor determining the solder adhesion ability between carrier HBGA substrate and solder ball. Using the temperature cycling test, shear test and drop test to distinguish the adhesion ability for lead-free solder balls on HBGA substrate assisted with several fluxes, the optimal process recipe was achieved. The soldering performance was impressive.
Keywords :
ball grid arrays; impulse testing; reflow soldering; HBGA assembly; ball-grid-array package; drop test; heat sinks; inter-metallic compound; oxygen concentration; oxygenous reflow; shear test; solder adhesion ability; solder ball; solder conjunction; solder stability; temperature cycling test; Adhesives; Copper; Corrosion; Heat sinks; Soldering; Substrates; Thermal stability;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4577-1387-3
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2011.6117249
