Solder stability for Pb-free HBGA assembly with oxygenous reflow

Author

Shih, Tien-Tsorng ; Chen, Wei-Chih ; Lee, Win-Der ; Wang, Mu-Chun

Author_Institution

Dept. of Electron. Eng., Nat. Kaohsiung Univ. of Appl. Sci., Kaohsiung, Taiwan

fYear

2011

fDate

19-21 Oct. 2011

Firstpage

435

Lastpage

438

Abstract

In ball-grid-array (BGA) package technology, the oxygen concentration in flow process predominantly influences the quality of solder conjunction such as oxidation causing aged effect and quality of inter-metallic compound. In addition, the flux as solder assistance is also a key factor determining the solder adhesion ability between carrier HBGA substrate and solder ball. Using the temperature cycling test, shear test and drop test to distinguish the adhesion ability for lead-free solder balls on HBGA substrate assisted with several fluxes, the optimal process recipe was achieved. The soldering performance was impressive.

Keywords

ball grid arrays; impulse testing; reflow soldering; HBGA assembly; ball-grid-array package; drop test; heat sinks; inter-metallic compound; oxygen concentration; oxygenous reflow; shear test; solder adhesion ability; solder ball; solder conjunction; solder stability; temperature cycling test; Adhesives; Copper; Corrosion; Heat sinks; Soldering; Substrates; Thermal stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International

Conference_Location

Taipei

ISSN

2150-5934

Print_ISBN

978-1-4577-1387-3

Electronic_ISBN

2150-5934

Type

conf

DOI

10.1109/IMPACT.2011.6117249

Filename

6117249