Title :
A fully integrated circuit for MEMS vibrating gyroscope using standard 0.25um CMOS process
Author :
Chiu, Sheng-Ren ; Sue, Chung-Yang ; Liao, Lu-Pu ; Teng, Li-Tao ; Hsu, Yu-Wen ; Su, Yan-Kuin
Author_Institution :
Microsyst. Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
Abstract :
This paper presents an all-in-one fully integrated circuit solution for a vibrating micro-electromechanical gyroscope system using standard 0.25um 1P5M low voltage CMOS process. The analog parts of the system include a trans-impedance amplifier (TIA) with adaptive gain control (AGC) for the resonator driving loop, a sigma-delta modulator with gain/offset trimming function for the Coriolis signal read-out and a modified all PMOS charge pump for the high DC voltage. The digital signal processing parts include a trimming/control logic circuit and an I2C interface. SOG-bulk micromachining and deep reactive ion etching (DRIE) are adopted to fabricate the gyroscope sensor element with high aspect-ratio sensing structure and high yield. The experimental results indicate that the noise floor achieves 0.051° / s/ √Hz and the scale factor is 7mV/ °/s of the proposed two chip MEMS gyroscope system.
Keywords :
CMOS integrated circuits; digital signal processing chips; gyroscopes; low-power electronics; micromachining; microsensors; sputter etching; vibrations; AGC; Coriolis signal read-out; DRIE; I2C interface; MEMS vibrating gyroscope system; SOG-bulk micromachining; TIA; adaptive gain control; all-in-one fully integrated circuit solution; deep reactive ion etching; digital signal processing; gain-offset trimming function; gyroscope sensor element; high DC voltage; microelectromechanical vibrating gyroscope system; modified all PMOS charge pump; resonator driving loop; sigma-delta modulator; size 0.25 mum; standard 1P5M low voltage CMOS process; transimpedance amplifier; trimming-control logic circuit; Application specific integrated circuits; Capacitors; Fingers; Gyroscopes; Micromechanical devices; Modulation; Sensors;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4577-1387-3
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2011.6117258