Design and experimental verifications of an integrated micro-gyroscope

Author

Chiu, Sheng-Ren ; Sue, Chung-Yang ; Lin, Shih-Ting ; Lin, Shih-Chieh ; Hsu, Yu-Wen ; Su, Yan-Kuin

Author_Institution

Microsyst. Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan

fYear

2011

fDate

19-21 Oct. 2011

Firstpage

319

Lastpage

322

Abstract

An integrated Z-axis micro-gyroscope is proposed in this paper. At first, the details of the mechanical structure design and dynamical analysis of micro-gyroscope is thoroughly discussed. The proposed micro-gyroscope is fabricated by the proposed high-aspect-ratio silicon-on-insulator bulk micro-machining process and integrated with the CMO S drive/sense ASIC by direct wire bonding. Finally, the preliminary experimental results of the presented integrated micro-gyroscope are examined and discussed.

Keywords

CMOS integrated circuits; application specific integrated circuits; gyroscopes; lead bonding; micromachining; microsensors; silicon-on-insulator; CMOS drive-sense ASIC; direct wire bonding; dynamical analysis; integrated Z-axis micro-gyroscope; mechanical structure design; silicon-on-insulator bulk micromachining process; Accelerometers; Capacitors; Electrodes; Gyroscopes; Resonant frequency; Springs; Suspensions;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International

Conference_Location

Taipei

ISSN

2150-5934

Print_ISBN

978-1-4577-1387-3

Electronic_ISBN

2150-5934

Type

conf

DOI

10.1109/IMPACT.2011.6117259

Filename

6117259