Title :
Complex power distribution network investigation using SPICE based extraction from first principle formulations
Author :
Selli, G. ; Drewniak, James L. ; DuBroff, R.E. ; Fan, Jintao ; Knighten, James L ; Smith, N.W. ; Archambeault, Bruce ; Grivet-Talocia, Stefano ; Canavero, Flavio
Author_Institution :
EMC Lab., Missouri Univ., Rolla, MO, USA
Abstract :
The modeling and the analysis of the power distribution networks (PDN) within multi-layer printed circuit board is crucial for the investigation of the performance of PCB systems. Carrying out such analyses in SPICE based tools has the advantage of being faster than the corresponding full-wave modeling and it allows obtaining both frequency and time domain results.
Keywords :
SPICE; frequency-domain analysis; integrated circuit interconnections; printed circuits; time-domain analysis; PCB systems; SPICE based extraction; frequency domain analysis; full-wave modeling; multilayer printed circuit board; power distribution network; time domain analysis; Analytical models; Frequency domain analysis; Geometry; Packaging; Performance analysis; Power system modeling; Power systems; Printed circuits; SPICE; Solid modeling;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563754
