DocumentCode
2843349
Title
The development of the performance measuring system for the phase change heat transport device-heat pipe, vapor chamber and defrost plate
Author
Lin, Wei-Keng ; Chao, Chen-I ; Tzou, Y.M. ; Chang, H.G.H. ; Wang, Paul
Author_Institution
ESS Dept., Nat. Tsing-Hua Univ., Hsin-Chu, Taiwan
fYear
2011
fDate
19-21 Oct. 2011
Firstpage
253
Lastpage
256
Abstract
A multipurpose of the performance measuring system for the phase change heat transport device such as heat pipe, vapor chamber and defrost plate was designed in this study. The characteristic of this measuring system was using thermal electrical chip (T.E.C.) as the condenser. This paper also present experimental measurement of performance of a vapor chamber (VC), heat pipe and defrost plate. The vapor chamber, with square sides of 50 × 50mm and thickness of 3.5mm and 6mm, was sandwiched between a heater block and a cooling plate located on the evaporator and the condenser surface respectively. The performance of the vapor chamber was investigated by determining the thermal resistance over a heat input range of 1 to 5W in natural convection test with the condenser opens at ambient environment and up to 40W in force convection with the condenser held at constant temperature. The experimental results show that the Maximum heat dissipated ability was the same compare with the new design measuring system and the traditional heat pipe performance measuring system with a water jacket as the cooling condenser. The thermal resistance in natural convection condition for the axial direction was around 0.1°C/W, while the spray thermal resistance was 0.12°C/W. For the defrost plate, the axial thermal resistance was 0.17°C/W and 0.18°C/W for the spray thermal resistance.
Keywords
forced convection; pipes; plates (structures); thermal resistance; axial thermal resistance; condenser; cooling plate; defrost plate; evaporator; force convection; heat pipe; performance measuring system; phase change heat transport device; spray thermal resistance; thermal electrical chip; thermal resistance; vapor chamber; Performance evaluation; Semiconductor device measurement; Temperature measurement; Thermal resistance; Water heating; heat pipe; spread thermal resistance; thermal resistance; vapor chambers;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4577-1387-3
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2011.6117272
Filename
6117272
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