Title :
Non-refrigerant thermoelectric air conditioning technique on vehicles
Author :
Hsu, Chung-Yen ; Li, Sheng-Liang ; Liu, Chun-Kai ; Tain, Ra-Min ; Chien, Heng-Chieh ; Hsu, Shi-Feng ; Tzeng, Chih-Ming ; Dai, Ming-Ji ; Chu, Hsu- Shen ; Hwang, Jenn-Dong
Author_Institution :
Ind. Technol. Res. Inst., Hsinchu, Taiwan
Abstract :
An electrical compressor technique of thermoelectric (TE) based climate control system in passenger vehicles provides solid state design and construction, non-refrigerants and the ability of providing faster time to comfort, beltless solution that enables engine-off air conditioner operation and modified the adversely impact by belt-driven vapor compression air conditioners, improved efficiency of positive temperature coefficient (PTC) heater systems. A complete scale TE air conditioning module was designed and adjusted to appropriate performance with CAE analyzing approaches, the well designed module proceeded practically constructed and tested on vehicle system to validate the design concept. In the design, system integration and energy management algorithms have been improved to further increase system level efficiency. To analyze the COP and cooling ability of the TE vehicle cooling system, a mathematical model is proposed, and a robust control algorithm is applied. The test results are presented and discussed.
Keywords :
air conditioning; energy management systems; mathematical analysis; refrigerants; robust control; thermoelectric cooling; CAE; COP; TE air conditioning module; TE vehicle cooling system; belt-driven vapor compression air conditioner; cooling ability; electrical compressor technique; engine-off air conditioner operation; mathematical model; nonrefrigerant thermoelectric air conditioning technique; passenger vehicle system; positive temperature coefficient heater system; robust control algorithm; solid state design; thermoelectric based climate control system; Air conditioning; Heat sinks; Heat transfer; Temperature measurement; Thermoelectricity; Vehicles;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4577-1387-3
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2011.6117279