Title :
CMOS ICs power-supply related decoupling properties
Author :
Vikinski, Omer ; Waizman, Alex
Author_Institution :
Intel Corp., Haifa, Israel
Abstract :
On-die decoupling plays important role in CMOS integrated circuits power delivery. A consistent extraction and modeling methodology of on-die inherent and intentional decoupling elements is presented. Measurements show accurate correlation to simulation of die capacitance.
Keywords :
CMOS integrated circuits; integrated circuit modelling; power supply circuits; CMOS integrated circuits; decoupling properties; die capacitance; intentional decoupling elements; on-die decoupling; on-die inherent decoupling elements; package-die resonance; power delivery; power-supply; CMOS integrated circuits; Capacitors; Circuit simulation; Integrated circuit layout; Integrated circuit packaging; Parasitic capacitance; Resistors; Semiconductor device modeling; Steady-state; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563767
