DocumentCode
2843478
Title
CMOS ICs power-supply related decoupling properties
Author
Vikinski, Omer ; Waizman, Alex
Author_Institution
Intel Corp., Haifa, Israel
fYear
2005
fDate
24-26 Oct. 2005
Firstpage
311
Lastpage
314
Abstract
On-die decoupling plays important role in CMOS integrated circuits power delivery. A consistent extraction and modeling methodology of on-die inherent and intentional decoupling elements is presented. Measurements show accurate correlation to simulation of die capacitance.
Keywords
CMOS integrated circuits; integrated circuit modelling; power supply circuits; CMOS integrated circuits; decoupling properties; die capacitance; intentional decoupling elements; on-die decoupling; on-die inherent decoupling elements; package-die resonance; power delivery; power-supply; CMOS integrated circuits; Capacitors; Circuit simulation; Integrated circuit layout; Integrated circuit packaging; Parasitic capacitance; Resistors; Semiconductor device modeling; Steady-state; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN
0-7803-9220-5
Type
conf
DOI
10.1109/EPEP.2005.1563767
Filename
1563767
Link To Document