DocumentCode
2843533
Title
On-chip bus interleaving revisited
Author
Elfadel, I.M.
Author_Institution
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2005
fDate
24-26 Oct. 2005
Firstpage
323
Lastpage
326
Abstract
Repeater interleaving is used to reduce the impact of capacitive coupling noise on the worst-case delay in local on-chip RC buses. In this paper, we revisit this interconnect design practice to evaluate it from the viewpoint of signal integrity of global on-chip interconnect used in on-chip high-speed signaling as between a cache and a CPU. Using accurate R(f)L(f)C electrical models of the global bus, we show that the peak crosstalk noise exhibits both monotonic and convex dependence on the interleaving ratio. Furthermore, we show that the worst-case switching pattern used in quantifying the common-mode noise (CMN) on the bus depends on the repeater interleaving ratio. This dependence makes the search of the optimal ratio that minimizes bus CMN quite challenging. The conclusions of this paper are valid for both unidirectional and bidirectional buses.
Keywords
RC circuits; crosstalk; integrated circuit design; integrated circuit interconnections; integrated circuit noise; bidirectional buses; capacitive coupling noise; electrical models; global on-chip interconnect; interconnect design; local on-chip RC buses; on-chip high-speed signaling; peak crosstalk noise; repeater interleaving; signal integrity; unidirectional buses; Crosstalk; Delay estimation; Interleaved codes; Noise cancellation; Noise figure; Noise reduction; Repeaters; Signal design; Space vector pulse width modulation; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN
0-7803-9220-5
Type
conf
DOI
10.1109/EPEP.2005.1563770
Filename
1563770
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