Title :
Surface-based finite element method for large-scale 3D circuit modeling
Author :
Jiao, Dan ; Chakravarty, Sourav ; Dai, Changhong ; Lee, Shiuh-Wuu
Author_Institution :
Circuit Technol. CAD, Intel Corp., Santa Clara, CA, USA
Abstract :
This paper presents a novel surface-based finite element method for full-wave modeling of large-scale 3D physical circuits. In contrast to traditional finite element methods that involve 3D volumetric unknowns, this method reduces the unknowns one needs to solve to those on 2D surface elements of interest only. It preserves the advantages of the finite element method in circuit application such as the flexibility in modeling irregular geometry, the capability in handling arbitrary inhomogeneity, and the handling of sparse matrices. Meanwhile, it eliminates the disadvantages long associated with traditional finite element methods such as large memory requirement and high CPU cost resulted from 3D volumetric discretization. Experimental and numerical results are given to demonstrate its accuracy and computational efficiency.
Keywords :
finite element analysis; integrated circuit modelling; sparse matrices; 2D surface element; irregular geometry modeling; large-scale 3D circuit modeling; large-scale 3D physical circuit; sparse matrices; surface-based finite element method; Computational electromagnetics; Finite element methods; Flexible printed circuits; Integrated circuit interconnections; Large-scale systems; Maxwell equations; Microprocessors; Parameter extraction; Power system modeling; Sparse matrices;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563777