DocumentCode :
2844848
Title :
Computationally Efficient Integration of Complex Thernal Multi-Chip Power Module Models into Circuit Simulators
Author :
Drofenik, Uwe ; Cottet, Didier ; Musing, Andreas ; Meyer, Jean-Marc ; Kolar, Johann W.
Author_Institution :
ETH Zurich, Zurich
fYear :
2007
fDate :
2-5 April 2007
Firstpage :
550
Lastpage :
557
Abstract :
For analyzing reliability or short-term overload conditions of power electronic systems, it is necessary to know transient temperatures of the power semiconductors. Directly coupling thermal and circuit simulators increases the simulation time by orders of magnitude, therefore making such an approach impractical. A well-known solution to this problem is to extract thermal equivalent circuits from 3D-field simulations and to insert them directly into the circuit simulator. In this paper we discuss the poor scaling performance of this state-of-the-art approach. There is an enormous increase in simulation time if there are more than just a few chips thermally modeled. We propose a general procedure at the circuit simulator solver level to increase the calculation speed of such a coupled simulation significantly.
Keywords :
circuit simulation; multichip modules; power electronics; power semiconductor devices; semiconductor device reliability; thermal analysis; 3D-field simulations; circuit simulators; computationally efficient integration; power electronic systems; power semiconductors; reliability; short-term overload conditions; thermal equivalent circuits; thermal multichip power module models; thermal simulators; transient temperatures; Circuit simulation; Computational modeling; Coupling circuits; Integrated circuit reliability; Multichip modules; Power electronics; Power system modeling; Power system reliability; Semiconductor device reliability; Transient analysis; electric-thermal simulation; increasing simulation speed; thermal coupling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Conversion Conference - Nagoya, 2007. PCC '07
Conference_Location :
Nagoya
Print_ISBN :
1-4244-0844-X
Electronic_ISBN :
1-4244-0844-X
Type :
conf
DOI :
10.1109/PCCON.2007.373020
Filename :
4239210
Link To Document :
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