Title :
A probe system for microwave characterization of transistor chips
Author :
Pan, J-J. ; Cooke, H.
Author_Institution :
Texas Instruments, Inc., Dallas, TX, USA
Keywords :
Bonding; Coaxial components; Dielectric measurements; Frequency; Microstrip; Microwave transistors; Noise figure; Packaging; Probes; Semiconductor device measurement;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1967 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1967.1154546
