• DocumentCode
    2845803
  • Title

    Finite element modeling of 3D interconnection structures

  • Author

    Tan, Jilin ; Pan, Guangwen

  • Author_Institution
    Compact Software Inc., Paterson, NJ, USA
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    957
  • Lastpage
    960
  • Abstract
    Three dimensional interconnection structures are modeled by an edge based finite element method. The corresponding boundary conditions at the planes of incidence and transmittance for hybrid modes are derived. These conditions take into account both the transverse and longitudinal field components of the propagating signals. Employing these boundary conditions, in conjunction with the absorbing boundary conditions (ABC) and/or the boundary conditions of the first and third order, a 3D asymmetrical functional is implemented as a hybrid vector edge element method. Numerical examples are presented for air bridges, a through-hole via and a spiral inductor. The equivalent frequency dependent circuit parameters are then extracted from the field solutions. Laboratory measurements and data comparison with previous published results strongly support the newly developed theoretical work
  • Keywords
    capacitance; finite element analysis; inductance; integrated circuit interconnections; integrated circuit modelling; transmission line theory; 3D asymmetrical functional; 3D interconnection structures; absorbing boundary conditions; air bridges; boundary conditions; circuit parameters extraction; edge based FEM; equivalent frequency dependent circuit parameters; field solutions; finite element modeling; hybrid modes; hybrid vector edge element method; longitudinal field components; spiral inductor; through-hole via; transverse field components; Boundary conditions; Bridge circuits; Equations; Equivalent circuits; Finite element methods; Frequency dependence; Integrated circuit interconnections; Spirals; Surface waves; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter Wave Technology Proceedings, 1998. ICMMT '98. 1998 International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-4308-5
  • Type

    conf

  • DOI
    10.1109/ICMMT.1998.768448
  • Filename
    768448