DocumentCode
2845803
Title
Finite element modeling of 3D interconnection structures
Author
Tan, Jilin ; Pan, Guangwen
Author_Institution
Compact Software Inc., Paterson, NJ, USA
fYear
1998
fDate
1998
Firstpage
957
Lastpage
960
Abstract
Three dimensional interconnection structures are modeled by an edge based finite element method. The corresponding boundary conditions at the planes of incidence and transmittance for hybrid modes are derived. These conditions take into account both the transverse and longitudinal field components of the propagating signals. Employing these boundary conditions, in conjunction with the absorbing boundary conditions (ABC) and/or the boundary conditions of the first and third order, a 3D asymmetrical functional is implemented as a hybrid vector edge element method. Numerical examples are presented for air bridges, a through-hole via and a spiral inductor. The equivalent frequency dependent circuit parameters are then extracted from the field solutions. Laboratory measurements and data comparison with previous published results strongly support the newly developed theoretical work
Keywords
capacitance; finite element analysis; inductance; integrated circuit interconnections; integrated circuit modelling; transmission line theory; 3D asymmetrical functional; 3D interconnection structures; absorbing boundary conditions; air bridges; boundary conditions; circuit parameters extraction; edge based FEM; equivalent frequency dependent circuit parameters; field solutions; finite element modeling; hybrid modes; hybrid vector edge element method; longitudinal field components; spiral inductor; through-hole via; transverse field components; Boundary conditions; Bridge circuits; Equations; Equivalent circuits; Finite element methods; Frequency dependence; Integrated circuit interconnections; Spirals; Surface waves; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave and Millimeter Wave Technology Proceedings, 1998. ICMMT '98. 1998 International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4308-5
Type
conf
DOI
10.1109/ICMMT.1998.768448
Filename
768448
Link To Document