Title :
Finite element modeling of 3D interconnection structures
Author :
Tan, Jilin ; Pan, Guangwen
Author_Institution :
Compact Software Inc., Paterson, NJ, USA
Abstract :
Three dimensional interconnection structures are modeled by an edge based finite element method. The corresponding boundary conditions at the planes of incidence and transmittance for hybrid modes are derived. These conditions take into account both the transverse and longitudinal field components of the propagating signals. Employing these boundary conditions, in conjunction with the absorbing boundary conditions (ABC) and/or the boundary conditions of the first and third order, a 3D asymmetrical functional is implemented as a hybrid vector edge element method. Numerical examples are presented for air bridges, a through-hole via and a spiral inductor. The equivalent frequency dependent circuit parameters are then extracted from the field solutions. Laboratory measurements and data comparison with previous published results strongly support the newly developed theoretical work
Keywords :
capacitance; finite element analysis; inductance; integrated circuit interconnections; integrated circuit modelling; transmission line theory; 3D asymmetrical functional; 3D interconnection structures; absorbing boundary conditions; air bridges; boundary conditions; circuit parameters extraction; edge based FEM; equivalent frequency dependent circuit parameters; field solutions; finite element modeling; hybrid modes; hybrid vector edge element method; longitudinal field components; spiral inductor; through-hole via; transverse field components; Boundary conditions; Bridge circuits; Equations; Equivalent circuits; Finite element methods; Frequency dependence; Integrated circuit interconnections; Spirals; Surface waves; Very large scale integration;
Conference_Titel :
Microwave and Millimeter Wave Technology Proceedings, 1998. ICMMT '98. 1998 International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4308-5
DOI :
10.1109/ICMMT.1998.768448