Title :
122-GHz chip-to-antenna wire bond interconnect with high repeatability
Author :
Beer, Stefan ; Gulan, Heiko ; Pauli, Mario ; Rusch, Christian ; Kunkel, Gerhard ; Zwick, Thomas
Author_Institution :
Institut fuer Hochfrequenztechnik und Elektronik (IHE), Karlsruhe Institute of Technology (KIT), Kaiserstr. 12, 76131, Germany
Abstract :
This paper presents a 122-GHz chip-to-antenna wire bond interconnect for low-cost, fully integrated transceivers. It is based on the standard ball-stitch bond technology and uses planar transmission lines for matching. A study on the effects of process tolerances is given. Finally, an antenna which is integrated into a QFN plastic package is characterized together with the chip-to-antenna interconnect.
Keywords :
Antenna measurements; Antennas; Integrated circuit interconnections; Semiconductor device measurement; Substrates; Transmission line measurements; Wires; Bonding processes; Integrated circuit interconnections; Millimeter wave integrated circuits; Millimeter wave technology; Packaging;
Conference_Titel :
Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International
Conference_Location :
Montreal, QC, Canada
Print_ISBN :
978-1-4673-1085-7
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2012.6258339
