DocumentCode :
2846072
Title :
An overview of reliability testing challenges in integrated power amplifier modules for wireless applications
Author :
Qu, Y. ; Scott, P. ; Marchut, L. ; Ferrara, M.
fYear :
2005
fDate :
Oct. 30, 2005
Firstpage :
95
Lastpage :
108
Keywords :
Assembly; Gallium arsenide; MMICs; Manufacturing industries; Power amplifiers; Qualifications; Radio frequency; Radiofrequency amplifiers; Semiconductor device packaging; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ROCS Workshop, 2005. [Reliability of Compound Semiconductors]
Print_ISBN :
0-7908-0106-X
Type :
conf
DOI :
10.1109/ROCS.2005.201556
Filename :
1563940
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2846072
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