Title :
Adhesion evaluation of adhesiveless metal/polyimide substrate for MCM and high density packaging
Author :
Jiang, Hunt ; Chou, Bill ; Beilin, Solomon
Author_Institution :
Fujitsu Comput. Packaging Technol. Inc., San Jose, CA, USA
Abstract :
Directly metallized polyimide films are being widely used as advanced high-density packaging substrates. Adhesion of metal to polyimide is a key performance requirement of the film. Excellent initial adhesion and good retention after severe process steps and reliability stresses are required. In this paper, the adhesion performances of films with different types of polyimide and tie layer from multiple vendors have been evaluated. The interface failure mechanisms are also examined via SEM micrographs and XPS survey scans. Peel strength and its retention behaviour are characterized in term of tie layer materials, environmental stresses and surface analysis results. The object of this work is to select the proper base material for high-density flexible multilayer substrates, a technology which is under development by FCPT
Keywords :
X-ray photoelectron spectra; adhesion; environmental stress screening; failure analysis; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; interface structure; mechanical strength; multichip modules; plastic packaging; polymer films; scanning electron microscopy; MCM; SEM micrographs; XPS survey scans; adhesion; adhesion performance; adhesion retention; adhesiveless metal/polyimide substrate; directly metallized polyimide films; environmental stresses; high density packaging; high-density flexible multilayer substrate base materials; high-density packaging substrates; initial adhesion; interface failure mechanisms; metal-to-polyimide adhesion; peel strength; peel strength retention; polyimide; reliability stresses; surface analysis; tie layer; tie layer materials; Adhesives; Copper; Flexible printed circuits; Humidity; Integrated circuit packaging; Metallization; Plasma temperature; Polyimides; Substrates; Thermal stresses;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670747
