Title :
Thermal acceleration of compound semiconductors in humidity
Author :
Roesch, William J.
Keywords :
Acceleration; Failure analysis; Humidity; Life estimation; Life testing; Moisture; Packaging; Plastics; Semiconductor device testing; Temperature;
Conference_Titel :
ROCS Workshop, 2005. [Reliability of Compound Semiconductors]
Print_ISBN :
0-7908-0106-X
DOI :
10.1109/ROCS.2005.201557
