Title :
Memory Access Scheduling Schemes for Systems with Multi-Core Processors
Author :
Zheng, Hongzhong ; Lin, Jiang ; Zhang, Zhao ; Zhu, Zhichun
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Chicago, Chicago, IL
Abstract :
On systems with multi-core processors, the memory access scheduling scheme plays an important role not only in utilizing the limited memory bandwidth but also in balancing the program execution on all cores. In this study, we propose a scheme, called ME-LREQ, which considers the utilization of both processor cores and memory subsystem. It takes into consideration both the long-term and short-term gains of serving a memory request by prioritizing requests hitting on the row buffers and from the cores that can utilize memory more efficiently and have fewer pending requests. We have also thoroughly evaluated a set of memory scheduling schemes that differentiate and prioritize requests from different cores. Our simulation results show that for memory-intensive, multiprogramming workloads, the new policy improves the overall performance by 10.7% on average and up to 17.7% on a four-core processor, when compared with scheme that serves row buffers hit memory requests first and allows memory reads bypassing writes; and by up to 9.2% (6.4% on average) when compared with the scheme that serves requests from the core with the fewest pending requests first.
Keywords :
microprocessor chips; multiprocessing systems; resource allocation; scheduling; ME-LREQ; memory access scheduling; memory-intensive workloads; multicore processors; multiprogramming workloads; program execution balancing; Bandwidth; Delay; Hardware; Multicore processing; Multithreading; Parallel processing; Processor scheduling; Read-write memory; Surface-mount technology; Yarn; Memory Access Scheduling; Multi-Core; Performance;
Conference_Titel :
Parallel Processing, 2008. ICPP '08. 37th International Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-0-7695-3374-2
Electronic_ISBN :
0190-3918
DOI :
10.1109/ICPP.2008.53