An approximate analysis of microstrip lines with finite metallization thickness and conductivity by method of lines

Author

Feng, N.-N. ; Fang, D.G. ; Huang, W.-P.

Author_Institution

Dept. of Electron. Eng., Nanjing Univ. of Sci. & Technol., China

fYear

1998

fDate

1998

Firstpage

1053

Lastpage

1056

Abstract

Using the approximate spectral domain Green´s function, which is based on the current and charge distribution at the top and bottom surfaces of the microstrip, an approximate analysis of microstrip lines with finite metallization thickness and conductivity by method of lines (MOL) combined with the synthetic asymptote method is presented. Also the loss of dielectric and ground plane have been taken into account in the analysis. Numerical results show the validity of this method

Keywords

Green´s function methods; current distribution; metallisation; method of lines; microstrip lines; approximate analysis; charge distribution; current distribution; dielectric plane loss; finite conductivity; finite metallization thickness; ground plane loss; method of lines; microstrip lines; spectral domain Green function; synthetic asymptote method; Attenuation; Conductivity; Conductors; Dielectric constant; Dielectric losses; MMICs; Metallization; Microstrip; Skin; Surface impedance;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter Wave Technology Proceedings, 1998. ICMMT '98. 1998 International Conference on

Conference_Location

Beijing

Print_ISBN

0-7803-4308-5

Type

conf

DOI

10.1109/ICMMT.1998.768471

Filename

768471