Title :
MCM/KGD development roadmap in Japan-EIAJ perspective
Author :
Sudo, Toshio ; Bonkohara, Manabu
Author_Institution :
Manuf. Eng. Res. Center, Toshiba Corp., Japan
Abstract :
The MCM/known good die (KGD) study group in EIAJ surveyed MCM/KGD activities in Japan and the future perspectives for various product areas. Major effort has been focused on chip scale package (CSP) development by every semiconductor manufacturer as an alternative to KGD in Japan, while MCMs with several bare dies are gradually being applied to notebook PCs and personal digital assistants (PDAs). However, bare-die test is still at a low level. High-density printed circuit boards are critical for both CSP and direct flip-chip attachment applications
Keywords :
flip-chip devices; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; multichip modules; printed circuits; EIAJ; EIAJ MCM/known good die study group; Japan; MCM/KGD development roadmap; MCMs; bare dies; bare-die test; chip scale package; direct flip-chip attachment; high-density printed circuit boards; known good die; notebook PCs; personal digital assistants; semiconductor manufacture; Chip scale packaging; Gold; Microprocessors; National electric code; Printed circuits; Semiconductor device manufacture; Semiconductor device packaging; Space technology; Substrates; Supercomputers;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670749
