MCM/KGD development roadmap in Japan-EIAJ perspective

Author

Sudo, Toshio ; Bonkohara, Manabu

Author_Institution

Manuf. Eng. Res. Center, Toshiba Corp., Japan

fYear

1998

fDate

15-17 Apr 1998

Firstpage

19

Lastpage

23

Abstract

The MCM/known good die (KGD) study group in EIAJ surveyed MCM/KGD activities in Japan and the future perspectives for various product areas. Major effort has been focused on chip scale package (CSP) development by every semiconductor manufacturer as an alternative to KGD in Japan, while MCMs with several bare dies are gradually being applied to notebook PCs and personal digital assistants (PDAs). However, bare-die test is still at a low level. High-density printed circuit boards are critical for both CSP and direct flip-chip attachment applications

Keywords

flip-chip devices; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; multichip modules; printed circuits; EIAJ; EIAJ MCM/known good die study group; Japan; MCM/KGD development roadmap; MCMs; bare dies; bare-die test; chip scale package; direct flip-chip attachment; high-density printed circuit boards; known good die; notebook PCs; personal digital assistants; semiconductor manufacture; Chip scale packaging; Gold; Microprocessors; National electric code; Printed circuits; Semiconductor device manufacture; Semiconductor device packaging; Space technology; Substrates; Supercomputers;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-4850-8

Type

conf

DOI

10.1109/ICMCM.1998.670749

Filename

670749