• DocumentCode
    2846605
  • Title

    Flow visualization of a particle deposition on silicon wafers in clean rooms

  • Author

    Kanazawa, S. ; Ohkubo, T. ; Adachi, T. ; Inokuchi, M. ; Shibuya, A.

  • Author_Institution
    Dept. of Electr. Eng., Oita Univ., Japan
  • fYear
    1991
  • fDate
    Sept. 28 1991-Oct. 4 1991
  • Firstpage
    640
  • Abstract
    Flow field around silicon wafer in a clean room is discussed on the basis of experimental results obtained using smoke visualization and the Schlieren method. Several examples of flow pattern are presented to show the influence of aerodynamic conditions on particle transportation. The characteristic flow phenomena around stagnation point flow and vortices generated behind the wafer are made clear from the observed streamlines by the Schlieren method. The observed flow field for the vertical airflow over a horizontal wafer is compared with the simulation result given in Liu et al. (1987). The dependence of airflow on wafer surface temperature is also discussed. Results show that the fluid flow for a normal condition is an axisymmetric flow, while, for a wafer heated condition, the behavior of fluid flow is changed extremely and the effect of thermal convection is dominant compared with the main downward air flow.<>
  • Keywords
    aerodynamics; clean rooms; convection in liquids; electrostatics; flow visualisation; vortices; Schlieren method; Si; aerodynamics; axisymmetric flow; clean rooms; electrostatics; flow pattern; flow visualisation; particle deposition; particle transportation; stagnation point flow; surface temperature; thermal convection; vortices; wafers; Aerodynamics; Contamination; Fluid flow; Lamps; Optical scattering; Silicon; Surface cleaning; Temperature control; Transportation; Visualization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Society Annual Meeting, 1991., Conference Record of the 1991 IEEE
  • Conference_Location
    Dearborn, MI, USA
  • Print_ISBN
    0-7803-0453-5
  • Type

    conf

  • DOI
    10.1109/IAS.1991.178239
  • Filename
    178239