• DocumentCode
    28471
  • Title

    {\\rm Al}^{+} Implanted 4H-SiC {\\rm p}^{+} -i-n Diodes: Forward Current Negative Temperatur

  • Author

    Nipoti, R. ; Moscatelli, F. ; De Nicola, Pietro

  • Author_Institution
    IMM of Bologna, Bologna, Italy
  • Volume
    34
  • Issue
    8
  • fYear
    2013
  • fDate
    Aug. 2013
  • Firstpage
    966
  • Lastpage
    968
  • Abstract
    Vertical 4H-Silicon Carbide p+-i-n diodes are obtained by a selective area 1.5×1020 cm-3 Al+ ion implantation of the anodes. These diodes are fabricated with identical steps except post-implantation annealing that is 1650°C/25 min and 1950°C/5 min. Electrical characterization in the temperature range 25°C-290°C is performed. The 1650°C/25 min diodes have forward currents with a positive temperature coefficient. The 1950°C/5 min diodes have forward current characteristics with a crossover point from a positive to a negative temperature coefficient that makes such characteristics almost stable versus temperature.
  • Keywords
    aluminium; anodes; ion implantation; p-i-n diodes; silicon compounds; wide band gap semiconductors; Al+; SiC; anodes; electrical characterization; forward current negative temperature coefficient; ion implantation; p+-i-n diodes; post-implantation annealing; temperature 1650 C; temperature 1950 C; temperature 25 C to 290 C; time 25 min; time 5 min; Annealing; Anodes; Light emitting diodes; Ohmic contacts; P-i-n diodes; Temperature; Temperature measurement; 4H-SiC; forward current; ion-implantation; p-i-n diode; specific contact resistance; temperature coefficient;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2013.2269863
  • Filename
    6555852