• DocumentCode
    2847159
  • Title

    Research and Design for Infrared Diagnostic System of Aviation Electronic Components

  • Author

    Wang, Li ; Cheng, Baoying ; Wang, Kun

  • Author_Institution
    Coll. of Aeronaut. Autom., Civil Aviation Univ. of China, Tianjin, China
  • Volume
    2
  • fYear
    2010
  • fDate
    13-14 Oct. 2010
  • Firstpage
    140
  • Lastpage
    142
  • Abstract
    The civil airports now mostly use the imported equipment, the maintenance of electronic circuit board becomes the important segment of aviation electronic equipment maintenance. In the rising and development of component level maintenance, as a new nondestructive testing technology, infrared fault diagnosis gets more research and application. The paper utilizes the Ti50 thermal infrared imager to design a set of electronic circuit of infrared diagnostic system. Considering the real-time and complexity of electronic circuit board, by applying different signal sources, we first group the electronic components of electronic circuit board, then measure, which can rapidly narrow the scope of failure and prevent undetected. Through testing laboratories and the actual use, the speed of the test system is high, diagnostic efficiency is good, with a strong practical value.
  • Keywords
    aircraft maintenance; airports; avionics; infrared imaging; nondestructive testing; printed circuits; aviation electronic components; aviation electronic equipment maintenance; civil airports; electronic circuit board maintenance; infrared diagnostic system; infrared fault diagnosis; nondestructive testing; signal sources; thermal infrared imager; Aerospace electronics; Electronic circuits; Electronic components; Maintenance engineering; Real time systems; Software; Temperature measurement; Component level maintenance; Infrared detection; NDE; Printed circuit board;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent System Design and Engineering Application (ISDEA), 2010 International Conference on
  • Conference_Location
    Changsha
  • Print_ISBN
    978-1-4244-8333-4
  • Type

    conf

  • DOI
    10.1109/ISDEA.2010.361
  • Filename
    5743395