• DocumentCode
    2847682
  • Title

    Stable schedule for a single-armed cluster tool with time constraints

  • Author

    Kim, Ja-Hee

  • Author_Institution
    Grad. Sch. of Public Policy & Inf. Technol., Seoul Nat. Univ. of Technol., Seoul
  • fYear
    2008
  • fDate
    23-26 Aug. 2008
  • Firstpage
    97
  • Lastpage
    102
  • Abstract
    The semiconductor manufacturing industry increasingly requires cluster tools, which consist of several single-wafer processing modules, a wafer-handling robot, and loadlocks. Some processes, such as low-pressure chemical vapor deposition, require strict time window constraints due to residual gases and heat in the chamber. The cluster tool should be operated at a steady schedule to minimize the maximum wafer delays and maintain a uniform quality of wafers, However, unforeseen events such as wafer alignment failures and retrials cause disruptions in the schedule and hence increase the variability of wafer delays within a process module. Therefore, it is important to determine the control strategies required to return to a steady schedule after sporadic disruptive events occur.We develop conditions to stabilize timing of a single-armed cluster tool using the convergence theory of a class of matrix power series in (max, +)-algebra. To derive the conditions, we model the cluster tool using a timed event graph and analyze the conditions for which the earliest firing schedule pattern of the event graph converges to a unique steady schedule, regardless of the initial schedule pattern or any disruption. From these conditions, we develop stabilizing strategies for the schedule by delaying certain robot tasks or increasing the process times. We experimentally demonstrate and compare the effectiveness and efficiency of our strategies.
  • Keywords
    chemical vapour deposition; convergence; industrial robots; integrated circuit manufacture; process control; chemical vapor deposition; convergence theory; loadlocks; matrix power series; maximum wafer delays; semiconductor manufacturing industry; single-armed cluster tool; single-wafer processing modules; time constraints; wafer-handling robot; Chemical vapor deposition; Convergence; Delay; Gases; Job shop scheduling; Manufacturing industries; Pattern analysis; Service robots; Time factors; Timing; cluster tool; discrete event system; linear system; max-plus algebra; stability; wafer delay;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation Science and Engineering, 2008. CASE 2008. IEEE International Conference on
  • Conference_Location
    Arlington, VA
  • Print_ISBN
    978-1-4244-2022-3
  • Electronic_ISBN
    978-1-4244-2023-0
  • Type

    conf

  • DOI
    10.1109/COASE.2008.4626464
  • Filename
    4626464