DocumentCode :
2848161
Title :
Post-Silicon Design Methodology on Chip Power Characterization, Validation, and Debug Applied on High Performance Per Watt Microprocessor
Author :
Chen, Yuan-Chuan Steven ; Lu, Daniel ; Yuan, Gang
Author_Institution :
Intel Corp., Hillsboro
fYear :
2007
fDate :
25-27 April 2007
Firstpage :
1
Lastpage :
4
Abstract :
As performance per Watt concept being adapted on CPU´s performance, a comprehensive post-silicon design methodology on chip power characterization, debug, and validation developed for an energy-efficient product performance become ever more important. An infrared photon-emission (IREM) based technique has been established to meet the needs. With those developed tool capabilities, we can validate simulated fullchip power, determine the causes of excessive power leakage, generate die power and thermal maps, and eventually optimize follow-on designs for power performance. This newly developed techniques have been applied and proven reusable on multiple core microprocessors fabricated under 90 nm and 65 nm CMOS technology. Examples of 5-8% power saving as compared with the first silicon data are presented here to demonstrate the success on debug and design optimization on full chip power.
Keywords :
CMOS integrated circuits; integrated circuit design; microprocessor chips; optical microscopy; CMOS technology; chip power characterization; debug; design optimization; energy-efficient product; high performance per watt microprocessor; infrared photon-emission based technique; multiple core microprocessors; post-silicon design methodology; size 65 nm; size 90 nm; validation; CMOS technology; Design methodology; Design optimization; Energy management; Leakage current; Microprocessors; Power generation; Silicon; Thermal management; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, Automation and Test, 2007. VLSI-DAT 2007. International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
1-4244-0583-1
Electronic_ISBN :
1-4244-0583-1
Type :
conf
DOI :
10.1109/VDAT.2007.373233
Filename :
4239425
Link To Document :
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