Title :
A probe routing algorithm for MCM substrate test
Author :
Yan, Rongchang ; Kim, Bruce C.
Author_Institution :
Dept. of Electr. Eng., Tufts Univ., Medford, MA, USA
Abstract :
In this paper, we describe a novel heuristic algorithm based on the single-ended probe which is used to reduce the single-ended probe travel time in MCM substrate testing. Our algorithm has been successfully implemented and compared with previous results. The results show that significant improvements are achieved using the new heuristic algorithm
Keywords :
automatic testing; circuit reliability; integrated circuit interconnections; integrated circuit packaging; multichip modules; printed circuit testing; MCM substrate test; MCM substrate testing; heuristic algorithm; probe routing algorithm; single-ended probe; single-ended probe travel time; Capacitance; Costs; Heuristic algorithms; Optical films; Optical interconnections; Packaging; Probes; Routing; Substrates; Testing;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670760
