Title :
Real time stress monitoring in reflow solder: Cu thin films in Si(111)
Author :
Song, Li ; Bing, An ; Tong-jun, Zhang ; Yi-ping, Wu ; Wei, Dai
Author_Institution :
State Key Lab. of Die & Mould Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
fDate :
30 Aug.-2 Sept. 2005
Abstract :
Substrate curvature method (SCM) is a versatile optical stress measuring method which owns a lot of merits: realtime, rapid, nondestructive, easily operating. A film stress measuring apparatus by SCM was developed, and stresses in Ag/Cu multilayer thin films and reflow solder on Cu thin films in Si(111) prepared by RF magnetron sputtering were detected. The stress-temperature behavior was studied. The stresses in Ag/Cu multilayer thin films were different due to different temperature. The stresses in reflow solder on Cu thin films in Si(111) were different due to the generation of excessive amounts of intermetallic compound. The results identify that the interfacial reaction kinetics has effect on wetting dynamics in evidence.
Keywords :
copper alloys; nondestructive testing; reflow soldering; silicon alloys; silver alloys; solders; sputtering; stress measurement; Ag-Cu; Cu-Si; RF magnetron sputtering; film stress measuring apparatus; interfacial reaction kinetics; intermetallic compound; multilayer thin films; optical stress measuring method; real time stress monitoring; reflow solder; stress-temperature behavior; substrate curvature method; wetting dynamics; Intermetallic; Magnetic multilayers; Monitoring; Optical films; Radio frequency; Sputtering; Stress measurement; Substrates; Temperature; Transistors;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564607
