Title :
A large-scale integration hybrid substrate
Author :
Dumesnil, M. ; Schroeder, Jochen
Author_Institution :
Fairchild Semiconductor, Palo Alto, CA, USA
Abstract :
Two high-density multichip subsystems utilizing beam lead ICs and multilayer metal technology on large ceramic substrates will be described: a 26-IC dual four-bit arithmetic unit (1" by 2") and a 16 k/b random-access MOS memory (304 ICs) on a 4" by 5" alumina card.
Keywords :
Aluminum; Ceramics; Circuit testing; Conductivity; Costs; Dielectric substrates; Glass; Large scale integration; Silicon; Solid state circuits;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1969 IEEE Internationa
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1969.1154767
