Detecting and Analyzing Wafer Bump Voids with X-Ray Inspection

Many different inspection systems are available to manufacturers of electronic components. But new inspection challenges are pushing - and in many cases exceeding - the limits of conventional inspection tools, such as wafer probes and automated optical inspection systems. A more capable alternative is X-ray technology, which can penetrate substrate materials to expose hidden features in electronic assemblies. Equipped with this cutting-edge tool for detecting material flaws and component defects, manufacturers can improve product quality and increase customer satisfaction, while also reducing costs and increasing manufacturing efficiency. This paper discusses X-ray inspection systems and their importance in failure analysis and process control of electronic components. Besides describing basic X-ray technology, the paper looks at a number of recent developments in X-ray systems and shows how these developments improve the inspection of TCs, PCBs, packages, and wafer bumps