DocumentCode
2848763
Title
The Effects of ONO thickness on Memory Characteristics in Nano-scale Charge Trapping Devices
Author
Kim, Moon Kyung ; Chae, Soodoo ; Kim, Chung Woo ; Kim, Jooyeon ; Tiwari, S.
Author_Institution
Cornell Univ., Ithaca
fYear
2007
fDate
23-25 April 2007
Firstpage
1
Lastpage
2
Abstract
In the use of single/few electrons in distributed storage for nonvolatile, low power and fast memories, providing statistical reproducibility at the nanoscale is a key challenge since relative variance has a radicn dependence and we are working with limited number of storage sites. We have used defects at interfaces of dielectrics to evaluate this reproducibility and evaluate the performance of memories. These experiments show that nearly 100 electrons can be stored at 30 nm dimensions, sufficient for reproducibility, and that a minimum of tunneling oxide thickness is required to assure reliable retention characteristics. Different tunneling oxide thicknesses and the effect of low doped drain (LDD) process is investigated to draw these conclusions.
Keywords
electron traps; flash memories; nanoelectronics; nanotechnology; random-access storage; semiconductor storage; semiconductor-insulator-semiconductor devices; SONOS thickness effects; dielectric interfaces; distributed storage; flash memory devices; low doped drain process; memory characteristics; nanoscale charge trapping devices; nonvolatile storage; relative variance; reliable retention characteristics; silicon-oxide-oxide-silicon; size 30 nm; statistical reproducibility; tunneling oxide thickness; Degradation; Electron traps; Energy states; Leakage current; Nanoscale devices; Reproducibility of results; SONOS devices; Silicon; Threshold voltage; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems and Applications, 2007. VLSI-TSA 2007. International Symposium on
Conference_Location
Hsinchu
ISSN
1524-766X
Print_ISBN
1-4244-0584-X
Electronic_ISBN
1524-766X
Type
conf
DOI
10.1109/VTSA.2007.378897
Filename
4239465
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