Adapting multichip module foundries for MEMS packaging

Author

Butler, Jeffrey T. ; Bright, Victor M. ; Chu, Patrick B. ; Saia, Richard J.

Author_Institution

Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA

fYear

1998

fDate

15-17 Apr 1998

Firstpage

106

Lastpage

111

Abstract

Methods of packaging micro-electro-mechanical systems (MEMS) using advanced multichip module (MCM) foundry processes are described. MCM packaging provides an efficient solution for integration of MEMS with other microelectronic technologies. The MCM foundries investigated for MEMS packaging were the General Electric high density interconnect (HDI) and chip-on-flex (COF) processes, as well as the Micro Module Systems (MMS) MCM-D process. Bulk and surface micromachined test die were packaged with CMOS electronics using these MCM foundries. Procedures were developed to successfully release and assemble the MEMS devices without degrading the MCM package or any other die in the module. The use of MCM foundries enables the cost-effective development of microsystems in situations for which monolithic integration of MEMS and microelectronics is not suitable

Keywords

CMOS integrated circuits; integrated circuit interconnections; integrated circuit packaging; microassembling; micromechanical devices; multichip modules; CMOS electronics; General Electric HDI process; General Electric chip-on-flex process; MCM foundry processes; MCM package; MCM packaging; MEMS device assembly; MEMS device release; MEMS integration; MEMS packaging; Micro Module Systems MCM-D process; bulk micromachined test die; cost-effective microsystems development; micro-electro-mechanical systems; microelectronic technology integration; monolithic MEMS/microelectronics integration; multichip module foundries; multichip module foundry processes; packaging; surface micromachined test die; Assembly; CMOS technology; Electronic equipment testing; Electronics packaging; Foundries; Microelectromechanical devices; Microelectromechanical systems; Microelectronics; Micromechanical devices; Multichip modules;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-4850-8

Type

conf

DOI

10.1109/ICMCM.1998.670763

Filename

670763