Analysis of Heat Dissipation Performance of CVD Diamond Film´s Sink for 3D-MCM

3D-MCM may play a important role in microelectronics in next century, a key problem must be solved: how to remove internal heat to exterior effectively in practical use . This work describes the use of CVD-diamond on stacked 3D-MCM thermal management, the symmetry of the model was utilized, a three dimensional model of only 1/4 section of the model was built and numerical simulation based on FEA was performed. A comparison was made between the calculated temperature distribution using CVD-Diamond and that using other materials .