Title :
Numerical modelling for electronic packaging - future requirements
Author_Institution :
Sch. of Comput. & Math. Sci., Greenwich Univ., London, UK
fDate :
30 Aug.-2 Sept. 2005
Abstract :
The fabrication, assembly and testing of electronic packaging can involve complex interactions between physical phenomena such as temperature, fluid flow, electromagnetics, and stress. Numerical modelling and optimisation tools are key computer-aided-engineering technologies that aid design engineers. This paper discusses these technologies and there future developments.
Keywords :
computer aided engineering; electronics packaging; numerical analysis; optimisation; computer aided engineering technologies; electromagnetics; electronic packaging assembly; electronic packaging fabrication; electronic packaging testing; fluid flow; numerical modelling; optimisation tools; stress; temperature; Assembly; Design optimization; Electromagnetics; Electronic equipment testing; Electronics packaging; Fabrication; Fluid flow; Numerical models; Stress; Temperature;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564645
