DocumentCode
2849050
Title
Numerical modelling for electronic packaging - future requirements
Author
Bailey, C.
Author_Institution
Sch. of Comput. & Math. Sci., Greenwich Univ., London, UK
fYear
2005
fDate
30 Aug.-2 Sept. 2005
Firstpage
25
Lastpage
26
Abstract
The fabrication, assembly and testing of electronic packaging can involve complex interactions between physical phenomena such as temperature, fluid flow, electromagnetics, and stress. Numerical modelling and optimisation tools are key computer-aided-engineering technologies that aid design engineers. This paper discusses these technologies and there future developments.
Keywords
computer aided engineering; electronics packaging; numerical analysis; optimisation; computer aided engineering technologies; electromagnetics; electronic packaging assembly; electronic packaging fabrication; electronic packaging testing; fluid flow; numerical modelling; optimisation tools; stress; temperature; Assembly; Design optimization; Electromagnetics; Electronic equipment testing; Electronics packaging; Fabrication; Fluid flow; Numerical models; Stress; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN
0-7803-9449-6
Type
conf
DOI
10.1109/ICEPT.2005.1564645
Filename
1564645
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