Title :
Prediction of Solder Joint geometry for Optical Fiber attachment Assembly in Direct-Coupling Applications
Author :
Wei, Zhang ; Chunqing, Wang ; Yanhong, Tian
Author_Institution :
Sch. of Material Sci. & Eng., Harbin Inst. of Technol.
Abstract :
Fiber attachment soldering is low cost and high-precision technology in direct-coupling optoelectronic packaging. The three-dimensional shape of solder joint in fiber attachment soldering was predicted by using the public domain software called Surface Evolver. The influences of material and manufacturing parameters on solder joint geometry and the stand-off height were investigated. The results can be used to control the solder joint geometry and to improve the alignment of optical fiber
Keywords :
electronics packaging; integrated optoelectronics; optical fibre couplers; optical interconnections; soldering; 3D shape; Surface Evolver; direct-coupling application; fiber attachment soldering; optical fiber attachment assembly; optoelectronic packaging; public domain software; solder joint geometry prediction; Application software; Assembly; Costs; Geometrical optics; Joining materials; Optical fibers; Optical materials; Packaging; Shape; Soldering;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564649
