Title :
3D System Integration
Author :
Klumpp, Armin ; Merkel, Reinhard ; Ramm, Peter ; Wieland, Robert
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Munich
Abstract :
3D-integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity just by combining devices of different technologies. For ultra thin silicon is the base of this integration technology, the fundamental concepts will be described, as well as appropriate handling concepts.
Keywords :
chip scale packaging; integrated circuit interconnections; low-power electronics; multichip modules; system-in-package; 3D system integration; interconnect densities; low power consumption; multiple chip stacks; ultra thin silicon technologies; Appropriate technology; Copper; Electric resistance; Energy consumption; Power system interconnection; Power system reliability; Silicon; Solids; Through-silicon vias; Wiring;
Conference_Titel :
VLSI Technology, Systems and Applications, 2007. VLSI-TSA 2007. International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
1-4244-0584-X
Electronic_ISBN :
1524-766X
DOI :
10.1109/VTSA.2007.378924
