DocumentCode
2849345
Title
The Impact of reliability requirements on LSI technology
Author
Schnable, G. ; Keen, R. ; Schlacter, Michael
Author_Institution
Philco-Ford Corp., Blue Bell, PA, USA
Volume
XIII
fYear
1970
fDate
18-20 Feb. 1970
Firstpage
146
Lastpage
147
Abstract
The reliability advantages of LSI will be compared with the adverse reliability effects in LSI fabrication technology, noting that LSI circuits will be more reliable per function accomplished than conventional integrated circuits, but less reliable in terms of packaged device failure rates. New techniques for insuring in-process control during fabrication will be reviewed, and the application of such techniques to reliability improvement will be described.
Keywords
Circuit testing; Dielectrics; Economic forecasting; Failure analysis; Large scale integration; MOS devices; Packaging; Power generation economics; Vehicles; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference. Digest of Technical Papers. 1970 IEEE International
Conference_Location
Philadelphia, PA, USA
Type
conf
DOI
10.1109/ISSCC.1970.1154813
Filename
1154813
Link To Document