Title :
The Impact of reliability requirements on LSI technology
Author :
Schnable, G. ; Keen, R. ; Schlacter, Michael
Author_Institution :
Philco-Ford Corp., Blue Bell, PA, USA
Abstract :
The reliability advantages of LSI will be compared with the adverse reliability effects in LSI fabrication technology, noting that LSI circuits will be more reliable per function accomplished than conventional integrated circuits, but less reliable in terms of packaged device failure rates. New techniques for insuring in-process control during fabrication will be reviewed, and the application of such techniques to reliability improvement will be described.
Keywords :
Circuit testing; Dielectrics; Economic forecasting; Failure analysis; Large scale integration; MOS devices; Packaging; Power generation economics; Vehicles; Wire;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1970 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1970.1154813
