Title :
Microwave integrated circuit technology
Author_Institution :
RCA Laboratories, Princeton, NJ, USA
Abstract :
Today´s microwave engineers have been confronted with a bewildering array of claims for the use of new materials and unique physical configurations to reduce size and improve types and performance of microwave components. The various technologies associated with the fabrication of hybrid and monolithic integrated circuits using lumped and/or distributed elements will be reviewed and evaluated. A number of industry points-of-view will also be explored.
Keywords :
Adhesives; Conducting materials; Conductivity; Conductors; Dielectric substrates; Dielectric thin films; Integrated circuit technology; Microstrip; Microwave devices; Microwave integrated circuits;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1970 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1970.1154815
