• DocumentCode
    2849403
  • Title

    90nm Phase Change Technology with μTrench and Lance Cell Elements

  • Author

    Atwood, G. ; Bez, R.

  • Author_Institution
    Intel Corp., Santa Clara
  • fYear
    2007
  • fDate
    23-25 April 2007
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Phase change memory is rapidly emerging as a promising next generation non volatile memory, offering unique capabilities for performance and functionality. Integration of the chalcogenide phase change material into a memory cell structure and memory array offers many challenges and opportunities. In this paper, the electrical properties of two possible cell structures, μTrench and Lance, will be compared using multi-megabit arrays at 90 nm. Results of the integration of PCM at 90 nm using a bipolar selector and with a cell area of 12 F2 will be described, demonstrating the suitability of PCM for high density memory applications.
  • Keywords
    isolation technology; nanoelectronics; phase change materials; random-access storage; semiconductor storage; μTrench elements; Lance cell elements; bipolar selector; chalcogenide material; high-density memory; memory array; memory cell structure; nonvolatile memory; phase change memory technology; size 90 nm; Costs; Educational institutions; Flash memory; History; Nonvolatile memory; Phase change materials; Phase change memory; Phased arrays; Scalability; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems and Applications, 2007. VLSI-TSA 2007. International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1524-766X
  • Print_ISBN
    1-4244-0584-X
  • Electronic_ISBN
    1524-766X
  • Type

    conf

  • DOI
    10.1109/VTSA.2007.378938
  • Filename
    4239506