• DocumentCode
    2849479
  • Title

    Board Level FBGA Package Combined Thermal Cycling & Bending Fatigue Study

  • Author

    Wang, Hui ; Zhou, Jianwei ; Lee, Taekoo ; Wang, Jun ; Xiao, Fei

  • Author_Institution
    Samsung Semicond. China R&D Co. Ltd., Suzhou
  • fYear
    2005
  • fDate
    2-2 Sept. 2005
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    A combined thermal cycling and bending fatigue test method is proposed for board level FBGA package. The fatigue lifetime of the board level FBGA package is studied with the combined acceleration method both with experimental and numerical analysis. The influence of initial pre-temperature cycling treatment on the bending fatigue life is studied. The failure analysis of failed samples was conducted, cracks were found in different sites of the package. The numerical analysis of the combined temperature cycle test and bending test was conducted. The simulation results of fatigue lifetime and failure site correspond to the experiment result well
  • Keywords
    ball grid arrays; fatigue testing; bending fatigue test; fine pitch ball grid array package; temperature cycle test; Electrical resistance measurement; Electronic equipment testing; Electronic packaging thermal management; Failure analysis; Fatigue; Packaging machines; Semiconductor device packaging; System testing; Temperature; Thermal loading;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2005 6th International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    0-7803-9449-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2005.1564672
  • Filename
    1564672
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2849479