Title :
Rigid and nonrigid beam-lead substrates
Author :
Bachner, F. ; Cohen, Reuven ; McMahon, R.
Author_Institution :
MIT Lincoln Laboratory, Lexington, MA, USA
Abstract :
A technique providing apertured substrates with overhanging beam-lead conductors to interconnect standard monolithic chips will be discussed. Thermal properties, practical cell size, assembly procedures and comparative performance and cost of rigid and nonrigid beam lead substrates will be described.
Keywords :
Assembly systems; Conducting materials; Fabrication; Glass; Integrated circuit interconnections; Large scale integration; Packaging; Resists; Substrates; Windows;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1970 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1970.1154841
