• DocumentCode
    2849718
  • Title

    Rigid and nonrigid beam-lead substrates

  • Author

    Bachner, F. ; Cohen, Reuven ; McMahon, R.

  • Author_Institution
    MIT Lincoln Laboratory, Lexington, MA, USA
  • Volume
    XIII
  • fYear
    1970
  • fDate
    18-20 Feb. 1970
  • Firstpage
    94
  • Lastpage
    95
  • Abstract
    A technique providing apertured substrates with overhanging beam-lead conductors to interconnect standard monolithic chips will be discussed. Thermal properties, practical cell size, assembly procedures and comparative performance and cost of rigid and nonrigid beam lead substrates will be described.
  • Keywords
    Assembly systems; Conducting materials; Fabrication; Glass; Integrated circuit interconnections; Large scale integration; Packaging; Resists; Substrates; Windows;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference. Digest of Technical Papers. 1970 IEEE International
  • Conference_Location
    Philadelphia, PA, USA
  • Type

    conf

  • DOI
    10.1109/ISSCC.1970.1154841
  • Filename
    1154841
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2849718