Title :
Effect of Rare Earths on Microstructure and Properties of Sn2.0Ag0.7CuRE Solder Alloy
Author :
Keke, Zhang ; Guanghui, Cheng ; Yangchun, Yu ; Yanfu, Yan ; Hua, Man
Author_Institution :
Sch. of Mater. Sci. & Eng., Henan Univ. of Sci. & Technol., Luoyang
Abstract :
In the study the fabrication, microstructure, mechanical and physical properties and wettability of Sn2.0Ag0.7CuRE solder alloy are investigated. Result shows that when the content of RE<0.1%(mass fraction), RE distributes uniformly in the solder alloy, and the tensile strength and conductance of Sn2.0Ag0.7CuRE solder alloy are better than those of traditional Sn37Pb solder. Its elongation and spreading area are almost equal to that of Sn37Pb. When the content of RE reaches 0.5%, RE compounds can be easily found around the boundaries of grains and phases. The tensile strength and elongation and spreading area of Sn2.0Ag0.7 CuRE solder alloy all decrease sharply. Therefore, RE amount added to the Sn2.0Ag0.7CuRE solder alloy under 0.1% is proper
Keywords :
copper alloys; lead alloys; materials testing; rare earth alloys; silver alloys; solders; tensile strength; tin alloys; rare earth; solder alloy; tensile strength; Environmentally friendly manufacturing techniques; Fabrication; Lead; Materials science and technology; Mechanical factors; Microstructure; Optical microscopy; Production; Scanning electron microscopy; Surface-mount technology; SnAgCuRE solder alloy; microstructure; properties; rare earth;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564711
