Title :
Study of MEMS packaging technology
Author :
Yufeng, Zhang ; Xiaoyun, Tan ; Weiping, Chen ; Guowei, Zhang ; Xiaowei, Liu
Author_Institution :
MEMS Center, Harbin Inst. of Technol.
Abstract :
This paper describes the status and effects of packaging in the MEMS devices. It is pointed out that there are several marked characteristics in the MEMS differences with compare with that of IC packaging. Meanwhile it presents several methods and developing trends of MEMS packaging with the particular emphasis on analysis of its applications, including the packaging means and testing results after packaging of microaccelerometers, acoustic-vibration sensors and other MEMS devices. Some useful thoughts are also obtained. Finally the existing problems and the future directions of MEMS packaging technology are discussed
Keywords :
accelerometers; electronics packaging; microsensors; IC packaging; MEMS packaging; acoustic-vibration sensors; microaccelerometers; packaging effect; Accelerometers; Acoustic sensors; Costs; Electronics packaging; Integrated circuit packaging; Microelectromechanical devices; Micromechanical devices; Mirrors; Sensor phenomena and characterization; Space technology;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564712
