Novel fluorinated polyimides for microelectronics applications

A series of novel fluorinated polyimides were prepared, which could be easily dissolve in many organic solvents to give homogeneous and stable polyimide solution with solid content as high as 35-40 wt.%. The polyimide films obtained by casting the polymer solution followed by thermal imidization exhibited good thermal stability with high glass transition temperature and the temperature at 5% weight loss, and have outstanding mechanical properties. In addition, the fluorinated polyimide have low dielectric constants and dissipation factor, and very low moisture absorption.