Title :
Effect of unfilled underfill on drop test and thermal cycle reliability
Author :
Ibe, Edward S. ; Loh, Karl I. ; Luan, Jing-En ; Tee, Tong Yan
Author_Institution :
Zymet, Inc., East Hanover, NJ, USA
fDate :
30 Aug.-2 Sept. 2005
Abstract :
The work reported here explores the effect of underfill encapsulants on drop test and thermal cycle reliability of area array packages, such as BGA´s, CSP´s, and WL-CSP´s. An unfilled underfill was found to provide superior drop test performance. Silica filled underfill was found to provide superior thermal cycle performance. However, if the unfilled underfill provides adequate thermal cycle performance, its use yields substantial process benefits.
Keywords :
ball grid arrays; chip scale packaging; encapsulation; impact testing; integrated circuit reliability; integrated circuit testing; silicon compounds; thermal management (packaging); SiO2; area array packages; drop test; silica filled underfill; thermal cycle performance; thermal cycle reliability; underfill encapsulants; unfilled underfill; Assembly; Chip scale packaging; Electronic packaging thermal management; Mobile handsets; Silicon compounds; Testing; Thermal resistance; Thermal stresses; Vehicles; Viscosity; BGA; CSP; WL-CSP; drop; reliability; thermal cycle; underfill;
Conference_Titel :
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN :
0-7803-9449-6
DOI :
10.1109/ICEPT.2005.1564728
