Study on Optimizing Material Parameters in the Acoustic-Vibration Sensors Isolation Packaging System

The acoustic-vibration sensors system is a kind of MEMS devices, which has a potential application prospect and its packaging plays key part in the fabrication process. The double J-Iike package model for isolating the acoustic sensor has been chosen while packaging the acoustic-vibration sensors system in this paper. By using the finite element analysis software ANSYS 5.7, modal analysis has been applied on the package model to analyze the relationship between the isolating material parameters and the natural frequencies of the model, which is the key physical quantity for isolation. The results show that the first three natural frequencies increase with the increase of the Young´s modulus Y of the isolating material rubber, and they don´t change evidently when the Poisson´s ration mu increase and they decrease with the increase of Density phi . The optimized material parameters have been gained: Y = 1.0 times 10⁶ N/m², mu = 0.49 and phi = 1.2 times 10³ kg/m³