• DocumentCode
    2850589
  • Title

    Process management system analysis and design of SMT reflow soldering process

  • Author

    Chun-Quan, Li ; Zhao-hua, Wu

  • Author_Institution
    Dept. of Electron. Machinery & Transp. Eng., Guilin Univ. of Electron. Technol., China
  • fYear
    2005
  • fDate
    30 Aug.-2 Sept. 2005
  • Firstpage
    279
  • Lastpage
    284
  • Abstract
    Reflow soldering processes are the key processes affecting SMT product quality. First, in the paper, the essential of building SMT processes management was discussed. Then, based on the discussion, taking temperature data as the primary object, process management system analysis of reflow soldering processes was achieved from three aspects: temperature data acquisition, long-distance temperature data transmission and process management software design of reflow soldering processes. At last, general structure of system was advanced and process management system of SMT reflow soldering processes was built through hardware and software designs. The system can promote the improvement of process management ability and level of reflow soldering processes.
  • Keywords
    process design; quality management; reflow soldering; surface mount technology; SMT processes management; SMT reflow soldering process; hardware design; long-distance temperature data transmission; process management software design; process management system; product quality; temperature data acquisition; Buildings; Data acquisition; Data analysis; Data communication; Real time systems; Reflow soldering; Software design; Surface-mount technology; System analysis and design; Temperature; SMT; process management; reflow soldering processes; system design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2005 6th International Conference on
  • Print_ISBN
    0-7803-9449-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2005.1564743
  • Filename
    1564743