DocumentCode
2850589
Title
Process management system analysis and design of SMT reflow soldering process
Author
Chun-Quan, Li ; Zhao-hua, Wu
Author_Institution
Dept. of Electron. Machinery & Transp. Eng., Guilin Univ. of Electron. Technol., China
fYear
2005
fDate
30 Aug.-2 Sept. 2005
Firstpage
279
Lastpage
284
Abstract
Reflow soldering processes are the key processes affecting SMT product quality. First, in the paper, the essential of building SMT processes management was discussed. Then, based on the discussion, taking temperature data as the primary object, process management system analysis of reflow soldering processes was achieved from three aspects: temperature data acquisition, long-distance temperature data transmission and process management software design of reflow soldering processes. At last, general structure of system was advanced and process management system of SMT reflow soldering processes was built through hardware and software designs. The system can promote the improvement of process management ability and level of reflow soldering processes.
Keywords
process design; quality management; reflow soldering; surface mount technology; SMT processes management; SMT reflow soldering process; hardware design; long-distance temperature data transmission; process management software design; process management system; product quality; temperature data acquisition; Buildings; Data acquisition; Data analysis; Data communication; Real time systems; Reflow soldering; Software design; Surface-mount technology; System analysis and design; Temperature; SMT; process management; reflow soldering processes; system design;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN
0-7803-9449-6
Type
conf
DOI
10.1109/ICEPT.2005.1564743
Filename
1564743
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