Mechanical Test and Analysis on Reliability of Lead-free BGA Assembly

Author

Zhu, XiaoKun ; Qi, Bo ; Qu, Xin ; Wang, Jiaji ; Lee, Taekoo ; Wang, Hui

Author_Institution

Fudan-Sumsung Packaging Reliability Joint Lab, Fudan Univ., Shanghai

fYear

2005

fDate

2-2 Sept. 2005

Firstpage

1

Lastpage

5

Abstract

As environment pollution and health problem became more and more seriously concerned, the electronic packaging industry is facing the challenge of changeover to "green", using the lead-free solder alloy is the trend instead of the traditional ⁶³Sn/³⁷Pb solder. In this paper, a PCB-level drop test for BGA package will be introduced and the mechanism of the solder joint mechanical fatigue failure will be discussed in detail, in order to find out the relevant failure root causes. In addition, comparing the difference between the solder joint performance of lead-free and PbSn BGA package, the reliability of the lead-free one can be evaluated and a feedback link to the lead-free material selections and processing parameters improving will be provided

Keywords

ball grid arrays; fatigue testing; integrated circuit packaging; integrated circuit reliability; lead alloys; solders; tin alloys; PbSn; ball grid array assembly; electronic packaging; environment pollution; health problem; lead-free solder alloy; mechanical fatigue failure; Assembly; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Industrial pollution; Lead; Soldering; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2005 6th International Conference on

Conference_Location

Shenzhen

Print_ISBN

0-7803-9449-6

Type

conf

DOI

10.1109/ICEPT.2005.1564746

Filename

1564746