Mechanical Test and Analysis on Reliability of Lead-free BGA Assembly

As environment pollution and health problem became more and more seriously concerned, the electronic packaging industry is facing the challenge of changeover to "green", using the lead-free solder alloy is the trend instead of the traditional ⁶³Sn/³⁷Pb solder. In this paper, a PCB-level drop test for BGA package will be introduced and the mechanism of the solder joint mechanical fatigue failure will be discussed in detail, in order to find out the relevant failure root causes. In addition, comparing the difference between the solder joint performance of lead-free and PbSn BGA package, the reliability of the lead-free one can be evaluated and a feedback link to the lead-free material selections and processing parameters improving will be provided